Flexible Printed Circuit Fabrication, Component & Module Assembly

Flexible Circuits for Interconnect

  • Adhesive and adhesive-less materials
  • Thin dielectric materials
  • Thin copper (5μm, 9μm, 12μm and up)
  • Static and dynamic bending
  • Single to multi-layer constructions
  • Via interconnects (micro/blind/buried)
  • Rigid-flex constructions
  • HDI features
  • Signal integrity and high frequency

High Density Component Assembly

  • Solder attached chips (01005 and above)
  • TSOP, QFP, QFN, LCC, LGA, FBGA etc. Solder attached
  • Fine pitch IC chip bonding with ACF
  • Bare die on flex attachment (gold ball bonding)
  • Unique component package attachment

Higher Level Assembly

  • Flex circuit assembly to
    plastic or metal frames & housings 
  • Custom bending & forming
  • Specialized components
  • In-circuit and functional testing


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MFLEX is a trusted global leader in flexible printed circuits and technology solutions designed to enable innovation in smaller, smarter electronics and future design challenges.