Products

Flexible Circuit Assembly

Single Sided and Double Sided Assembly
  • FPC High Density Component Assembly
  • Solder attached chips (01005 and above)
  • TSOP, QFP, QFN, LCC, LGA, FBGA etc. Solder attached
  • Fine pitch IC chip bonding with ACF
  • Bare die on flex attachment (gold ball bonding)
  • Unique component package attachment