FPC and Advanced Component Assembly Technology Solutions Enable Innovation
- New Product Introduction (NPI) To Mass Production
- Low cost volume manufacturing with turnkey material, component procurement and supply chain logistics
- Quick ramp-to-volume delivery to meet your market penetration needs
- Continuous development of processes and capabilities to meet your requirements now and into the future
- The highest level of customer benefit through advanced assembly integration
Flexible Printed Circuit Fabrication, Component & Module Assembly
Flexible Circuits for Interconnect
- Adhesive and adhesive-less materials
- Thin dielectric materials
- Thin copper (5μm, 9μm, 12μm and up)
- Static and dynamic bending
- Single to multi-layer constructions
- Via interconnects (micro/blind/buried)
- Rigid-flex constructions
- HDI features
- Signal integrity and high frequency
High Density Component Assembly
- Solder attached chips (01005 and above)
- TSOP, QFP, QFN, LCC, LGA, FBGA etc. Solder attached
- Fine pitch IC chip bonding with ACF
- Bare die on flex attachment (gold ball bonding)
- Unique component package attachment
Higher Level Assembly
- Flex circuit assembly to
- plastic or metal frames & housings
- Custom bending & forming
- Specialized components
- In-circuit and functional testing
Engineering Services
Engineering Services in support of FPC & FPCA
- Electrical, Mechanical and Thermal simulation
- Design Rule verification and review
- FPC & FPCA training
Application Engineers Collaborate to Optimize Your Design, Manufacturing, Cost, and Delivery Objectives
MFLEX Application Engineers serve as an extension of your design group by providing real-time, side-by-side participation in your design.