FPC and Advanced Component Assembly Technology Solutions Enable Innovation

  • New Product Introduction (NPI) To Mass Production
  • Low cost volume manufacturing with turnkey material, component procurement and supply chain logistics
  • Quick ramp-to-volume delivery to meet your market penetration needs
  • Continuous development of processes and capabilities to meet your requirements now and into the future
  • The highest level of customer benefit through advanced assembly integration

Flexible Printed Circuit Fabrication, Component & Module Assembly

Flexible Circuits for Interconnect

  • Adhesive and adhesive-less materials
  • Thin dielectric materials
  • Thin copper (5μm, 9μm, 12μm and up)
  • Static and dynamic bending
  • Single to multi-layer constructions
  • Via interconnects (micro/blind/buried)
  • Rigid-flex constructions
  • HDI features
  • Signal integrity and high frequency

High Density Component Assembly

  • Solder attached chips (01005 and above)
  • TSOP, QFP, QFN, LCC, LGA, FBGA etc. Solder attached
  • Fine pitch IC chip bonding with ACF
  • Bare die on flex attachment (gold ball bonding)
  • Unique component package attachment

Higher Level Assembly

  • Flex circuit assembly to
  • plastic or metal frames & housings
  • Custom bending & forming
  • Specialized components
  • In-circuit and functional testing

Engineering Services

Engineering Services in support of FPC & FPCA

  • Electrical, Mechanical and Thermal simulation
  • Design Rule verification and review
  • FPC & FPCA training

Application Engineers Collaborate to Optimize Your Design, Manufacturing, Cost, and Delivery Objectives

MFLEX Application Engineers serve as an extension of your design group by providing real-time, side-by-side participation in your design.

Design For….

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Quality and Reliability
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